Ristolainen, Eero O: search on Z-Library

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1

Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications

Minna Arra, Dongkai Shangguan, Dongji Xie, Janne Sundelin, Toivo Lepistö, Eero Ristolainen

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 1.90 MB

english, 2004

2

Qualification of flip chip fluxes by wetting balance and surface insulation resistance tests

Tuominen, Aulis, Ristolainen, Eero, Lehtinen, Ville

Journal:

Soldering & Surface Mount Technology

Year:

1999

Language:

english

File:

PDF, 155 KB

english, 1999

3

Analysis of Substrates for Single Emitter Laser Diodes

Alander, Tapani M., Heino, Pekka A., Ristolainen, Eero O.

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 276 KB

english, 2003

4

Reliability of 80 μm pitch flip chip attachment on flex

Petteri Palm, Jarmo Määttänen, Aulis Tuominen, Eero Ristolainen

Journal:

Microelectronics Reliability

Year:

2001

Language:

english

File:

PDF, 321 KB

english, 2001

5

Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards

Arra, Minna, Shangguan, Dongkai, Ristolainen, Eero, Lepistö, Toivo

Journal:

Soldering & Surface Mount Technology

Year:

2002

Language:

english

File:

PDF, 576 KB

english, 2002

6

Characterization of mechanical performance of Sn/Ag/Cu solder joints with different component lead coatings

Arra, Minna, Castello, Todd, Shangguan, Dongkai, Ristolainen, Eero

Journal:

Soldering & Surface Mount Technology

Year:

2004

Language:

english

File:

PDF, 736 KB

english, 2004

7

Effect of PCB surface finish on creep properties of lead‐free solder joints

Sundelin, Janne J., Nurmi, Sami T., Lepistö, Toivo K., Ristolainen, Eero O.

Journal:

Soldering & Surface Mount Technology

Year:

2005

Language:

english

File:

PDF, 314 KB

english, 2005

8

Mechanical and microstructural properties of SnAgCu solder joints

Janne J. Sundelin, Sami T. Nurmi, Toivo K. Lepistö, Eero O. Ristolainen

Journal:

Materials Science and Engineering: A

Year:

2006

Language:

english

File:

PDF, 862 KB

english, 2006

9

Balancing temperature dependence of on-wafer SOS inductors

Päivi H. Karjalainen, Eero O. Ristolainen

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 274 KB

english, 2006

10

Anisotropic conductive film flip chip joining using thin chips

Erja Jokinen, Eero Ristolainen

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 212 KB

english, 2002

11

The effect of PCB surface finish on lead‐free solder joints

Nurmi, Sami T., Sundelin, Janne J., Ristolainen, Eero O., Lepistö, Toivo K.

Journal:

Soldering & Surface Mount Technology

Year:

2005

Language:

english

File:

PDF, 502 KB

english, 2005

12

Reliability of unencapsulated SMD plastic film capacitors

Seppälä, Anne, Saarinen, Kimmo, Ristolainen, Eero

Journal:

Soldering & Surface Mount Technology

Year:

2000

Language:

english

File:

PDF, 484 KB

english, 2000

13

Reducing bonding cycle time of adhesive flip chip process

Seppälä, Anne, Aalto, Kati, Ristolainen, Eero

Journal:

Soldering & Surface Mount Technology

Year:

2003

Language:

english

File:

PDF, 376 KB

english, 2003

14

Reliability of tin‐lead balled BGAs soldered with lead‐free solder paste

Tapani Nurmi, Sami, Olavi Ristolainen, Eero

Journal:

Soldering & Surface Mount Technology

Year:

2002

Language:

english

File:

PDF, 377 KB

english, 2002

15

A comparison of shielded and conventional on-wafer test-fixture forward coupling on silicon-on-insulator (SOI) substrate

Tero Kaija, Eero O. Ristolainen

Journal:

Microwave and Optical Technology Letters

Year:

2005

Language:

english

File:

PDF, 360 KB

english, 2005

16

Microstructure, creep properties, and failure mechanism of SnAgCu solder joints

Janne J. Sundelin, Sami T. Nurmi, Toivo K. Lepistö, Eero O. Ristolainen

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 341 KB

english, 2006

17

Effects of intermediate zinc pulses on properties of TiN and NbN films deposited by atomic layer epitaxy

Mikko Ritala, Timo Asikainen, Markku Leskelä, Janne Jokinen, Reijo Lappalainen, Mikko Utriainen, Lauri Niinistö, Eero Ristolainen

Journal:

Applied Surface Science

Year:

1997

Language:

english

File:

PDF, 1.09 MB

english, 1997

18

Dislocation initiation in copper—a molecular dynamics study

Pekka Heino, Eero Ristolainen

Journal:

Nanostructured Materials

Year:

1999

Language:

english

File:

PDF, 365 KB

english, 1999

19

Calibration Improvement for Piezoresistive Coefficients of Stress Sensors on (100) Silicon

Song, Weixia, Ristolainen, Eero

Journal:

Physica Scripta

Year:

2004

Language:

english

File:

PDF, 210 KB

english, 2004

20

The Effects of Metal Ground Shield on On-Chip Spiral Inductors

Karjalainen, Päivi, Rapelo, Juha, Ristolainen, Eero O

Journal:

Physica Scripta

Year:

2004

Language:

english

File:

PDF, 141 KB

english, 2004

21

Oxide Formation on NbAl3, and TiAl Due to Ion Implantation of 18O

Hanrahan, Robert J., Verink, Ellis D., Withrow, Stephen P., Ristolainen, Eero O.

Journal:

MRS Proceedings

Year:

1993

Language:

english

File:

PDF, 368 KB

english, 1993

22

[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - The Effect of Multiple Reflow Times on Lead-Free Solder Joint Microstructure

Nurmi, Sami T., Sundelin, Janne J., Ristolainen, Eero O., Lepistö, Toivo K.

Year:

2003

Language:

english

File:

PDF, 2.54 MB

english, 2003

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